Wafer Ring Frames are used in applications such as back-grinding, dicing, die pick & place, wafer sorting, die shipping and other in-process wafer handling operations. A back grind tape or film is typically mounted onto the ring which then holds the wafer (diced or thinned) in place during such applications.

We offer full range of wafer ring / frame sizes from 6”, 8” to 12”, both plastics and stainless steel version as well