Dicing / Singulation is a precision process taking place at the end of semiconductor process flow where semiconductor wafers are cut into small square or rectangular “chips” or “die”, traditionally by means of a saw blade or laser.  

Dicing or Singulation services is available for all types of substrates made from a wide range of material including ceramics, Aluminium Nitride, Sapphire, glass, quartz and many others

Precise, smooth, and chip free edges chips/ die is achievable from dicing process